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Model [sorted by
housing dimensions]
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Description / Comment
l Preferred stock
type ¢®
Limited stock X Not recommended for new development
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Dimensions
[mm3]
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Voltage
[kV]
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Pk. Current
[A]
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Peak Power
[MW]
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On-Time
[¥ìs]
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HTS 60-100-SCR
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l
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Tubular housing with pigtail connectors. Cooling options not
available.
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135 x 20 x 20
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6.4
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1000
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6.4
|
35¡¦¡Ä
|
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---------------
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HTS 60-200-SCR
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l
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LED indicators. Very compact design - CF options partly not
applicable!
|
80 x 38 x 25
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6.4
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2000
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12.8
|
35¡¦¡Ä
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HTS 120-100-SCR
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l
|
LED indicators. Very compact design - CF options partly not
applicable!
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80 x 38 x 25
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12.8
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1000
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12.8
|
35¡¦¡Ä
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---------------
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HTS 150-200-SCR
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l
|
LED indicators. Very compact design - CF options partly not
applicable!
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103 x 70 x 35
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15
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1000
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15
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35¡¦¡Ä
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HTS 300-100-SCR
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l
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LED indicators. Very compact design - CF options partly not
applicable!
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103 x 70 x 35
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30
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1000
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30
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35¡¦¡Ä
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---------------
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HTS 320-200-SCR
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l
|
LED indicators. Very compact design - CF options partly not
applicable!
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206 x 70 x 35
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32
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2000
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64
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35¡¦¡Ä
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HTS 400-200-SCR
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l
|
LED indicators. Very compact design - CF options partly not
applicable!
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206 x 70 x 35
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40
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2000
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80
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35¡¦¡Ä
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HTS 640-100-SCR
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l
|
LED indicators. Very compact design - CF options partly not
applicable!
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206 x 70 x 35
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64
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1000
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64
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35¡¦¡Ä
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---------------
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HTS 800-100-SCR
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l
|
LED indicators. Very compact design - CF options partly not
applicable!
|
250 x 70 x 35
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80
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1000
|
80
|
35¡¦¡Ä
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---------------
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HTS 600-200-SCR
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¢®
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With LED indicators. HV connection by pigtails only.
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372 x 120 x 50
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60
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2000
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120
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35¡¦¡Ä
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HTS 1200-100-SCR
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¢®
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With LED indicators. HV connection by pigtails only.
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372 x 120 x 50
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120
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1000
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120
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35¡¦¡Ä
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---------------
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HTS 40-1000-SCR
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l
|
Sync. I/O for parallel connection.
|
89 x 64 x 31
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4
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10000
|
40
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35¡¦¡Ä
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HTS 80-200-SCR
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l
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Sync. I/O for parallel connection.
|
89 x 64 x 31
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8
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2000
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16
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35¡¦¡Ä
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HTS 80-500-SCR
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l
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Sync. I/O for parallel connection.
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89 x 64 x 31
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8
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5000
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40
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35¡¦¡Ä
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HTS 160-200-SCR
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l
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Sync. I/O for parallel connection. HV connection by pigtails
only.
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89 x 64 x 31
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16
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2000
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32
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35¡¦¡Ä
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---------------
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HTS 60-1000-SCR
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l
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Sync. I/O for parallel connection.
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122 x 64 x 31
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6
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10000
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60
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35¡¦¡Ä
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HTS 120-200-SCR
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l
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Sync. I/O for parallel connection.
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122 x 64 x 31
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12
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2000
|
24
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35¡¦¡Ä
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HTS 120-500-SCR
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l
|
Sync. I/O for parallel connection.
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122 x 64 x 31
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12
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5000
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60
|
35¡¦¡Ä
|
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HTS 240-200-SCR
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l
|
Sync. I/O for parallel connection. HV connection by pigtails
only.
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122 x 64 x 31
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24
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2000
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48
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35¡¦¡Ä
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---------------
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HTS 80-1000-SCR
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l
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Sync. I/O for parallel connection.
|
153 x 64 x 31
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8
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10000
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80
|
35¡¦¡Ä
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HTS 160-500-SCR
|
l
|
Sync. I/O for parallel connection.
|
153 x 64 x 31
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16
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5000
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80
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35¡¦¡Ä
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HTS 160-200-SCR
|
l
|
Sync. I/O for parallel connection.
|
153 x 64 x 31
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16
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2000
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32
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35¡¦¡Ä
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HTS 320-200-SCR
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l
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Sync. I/O for parallel connection. HV connection by pigtails
only.
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153 x 64 x 31
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32
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2000
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64
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35¡¦¡Ä
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---------------
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HTS 100-1600-SCR
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l
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LED indicators & Sync. I/O for parallel connection
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179 x 103 x 35
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10
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16000
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160
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35¡¦¡Ä
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HTS 200-800-SCR
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l
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LED indicators & Sync. I/O for parallel connection
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179 x 103 x 35
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20
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8000
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160
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35¡¦¡Ä
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---------------
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HTS 220-800-SCR
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l
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LED indicators & Sync. I/O. Compact design- CF options partly
not applicable!
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174 x 103 x 35
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22
|
8000
|
176
|
35¡¦¡Ä
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---------------
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HTS 120-1600-SCR
|
l
|
LED indicators & Sync. I/O for parallel connection
|
204 x 103 x 35
|
12
|
16000
|
192
|
35¡¦¡Ä
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HTS 240-800-SCR
|
l
|
LED indicators & Sync. I/O for parallel connection
|
204 x 103 x 35
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24
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8000
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192
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35¡¦¡Ä
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---------------
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HTS 160-1600-SCR
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l
|
LED indicators & Sync. I/O for parallel connection
|
253 x 103 x 35
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16
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16000
|
256
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35¡¦¡Ä
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HTS 320-800-SCR
|
l
|
LED indicators & Sync. I/O for parallel connection
|
253 x 103 x 35
|
32
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8000
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256
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35¡¦¡Ä
|
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Option(1)
|
Description
|
|
|
|
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HFB
|
High Frequency Burst: Improved burst capability
of driver by means of external buffer capacitors. Recommended
if more than 10 pulses with less than 10 ¥ìs spacing
are generated.
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HFS
|
High Frequency Switching: External supply of auxiliary
driver voltage (50-350 VDC according to type). Necessary
if the specified ¡°Maximum Operating Frequency¡± shall
be exceeded.(2)
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LP
|
Low Pass: Low pass filter
at the control input. Propagation delay time will be
increased by ~50 ns. Jitter + 500 ps. Improved
noise immunity and less critical wiring in high
speed applications. (3)
|
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ST
|
Stage Tapping: Connectors at the individual stages
of stack in order to utilize single power semiconductors.
To achieve fast rise times also at very low operating
voltages (<0.01xVo).
|
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DT
|
Delayed Trigger: ¡°Total Turn-On Time¡± irreversibly increased
to >1 ¥ìs. Required if national or international export
restrictions apply (¡°dual use products¡±). (2)
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ISO-25
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25 kV Isolation: Isolation Voltage increased to
25 kVDC. Housing dimensions may change for some models.
|
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ISO-40
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40 kV Isolation: Isolation Voltage increased to 40
kVDC. Housing dimensions may change for some models.
Only in connection with option PT-HV.
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ISO-80
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80 kV Isolation: Isolation Voltage increased
to 80 kVDC. Housing dimensions may change for
some models. Only in connection with option PT-HV.
|
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ISO-120
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120 kV Isolation: Isolation Voltage increased
to 120 kVDC. Housing dimensions may change for some
models. Only in connection with option PT-HV.
|
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I-PC
|
Integrated Part Components: Integration of small part
components according to customer¡¯s specifications (e.g.
buffer capacitors, snubbers, damping resistors, diodes,
opto couplers).(2)
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I-FWD
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Integrated Free-Wheeling Diode: Built-in parallel
diode with short recovery time. In connection with inductive
load only.
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SPT-C
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Shielded Pigtail for Control Connection: Cable (l=300mm,
Z=100¥Ø) with LEMO plug+socket and 100¥Ø termination.
Improved noise immunity in case of long distance to
driver circuits.(3)(4)
|
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PT-C
|
Pigtail for Control Connection: Flexible leads (l=75 mm)
with PCB connector. This option is only relevant for
switching modules with pins. Recommended for modules
with options CF & GCF.
|
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PIN-C
|
Pins for Control Connection: Gold plated pins for printed
circuit board designs (special sockets available). This
option is only relevant for switching modules which
have pigtails as standard.
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PT-HV
|
Pigtails for HV Connection: Flexible leads with cable
lugs. For increased creepage. PT-HV is standard for
all types with >25 kV switching voltage. Not recommended
in extremely fast circuits.
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ST-HV
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Screw Terminals for HV Connection: Threaded inserts
at the bottom of module (if not standard). For PCB design.
Operation above 25 kV requires liquid insulation (Galden¢ç/Oil)
or potting.
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UL94
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Flame Retardant Casting Resin: Casting resin according
to UL-94-VO. Minimum order quantity required. (2)
|
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TH
|
Tubular Housing: Tubular instead of rectangular housing. Adaption
to specific ambient conditions or in case of difficult
assembly situations. (2)
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FC
|
Flat Case: Height of standard plastic housings reduced to
19 / 25 mm. Not in combination with cooling options
CF, GCF, DLC and HPMC.
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CF
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Non-Isolated Cooling Fins: Standard sizes in categories
I to VII according to model. Nickel plated copper 0.5
mm, fin height 35 mm. For air and liquid cooling (e.g.
Galden¢ç or oil).
|
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CF-1
|
Non-Isolated Cooling Fins d=1mm: Nickel plated copper 1.0
mm instead of 0.5 mm. The Max. Power Dissipation will
be increased by ~80 %. For air and liquid cooling (e.g.
Galden¢ç or oil).
|
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CF-X2
|
Non-Isolated Cooling Fins enlarged by x2: Fin area enlarged
by factor 2. Not relevant in connection with liquid
cooling.
|
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CF-X3
|
Non-Isolated Cooling Fins enlarged by x3: Fin area enlarged
by factor 3. Not relevant in connection with liquid
cooling and forced air convection.
|
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CF-CS
|
Non-Isolated Cooling Fins with customized shape: Individual shape
to meet specific OEM requirements. (2)
|
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CF-LC
|
Non-isolated Cooling Fins optimized for liquid cooling: Double fins,
nickel plated copper, 0.5 mm thickness, height 20 mm.
|
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CF-DR
|
Cooling Fin for Driver: Small extra cooling fin
for the control electronics. On ground potential. Can
be necessary in combination with HFS. (2)
|
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GCF
|
Grounded Cooling Flange: Nickel-plated copper flange
for High Power applications. Max. isolation voltage
40kV. Increased coupling capacitance CC.
In combination with option SPT-C only.
|
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GCF-X2
|
Grounded Cooling Flange, Max. Continuous Power Dissipation increased
by x2: Thermal resistance ¡°Switch to Flange¡± reduced
for twice the power capability. (2)
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GCF-W
|
Water Cooler for Grounded Cooling Flange: Flat water
cooling plate attached to the grounded cooling flange
GCF. With water inlet and outlet.
|
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DLC
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Direct Liquid Cooling: Internal liquid channel
in direct contact with the power semiconductors. Very
compact cooling solution for medium power. Galden¢ç and
non-conductive liquids only. (2)
|
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HPMC
|
High Power Metal Case: Potential free & hermetically
sealed metal housing filled with Galden¢ç. Available
both with heat sink flange or with secondary water coolant
circulation. From I/2002. (2)
|
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HI-REL
|
High Reliability / MIL Versions: Available on request.
(2)
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(1) New option code: Data sheets may differ from this
coding system (especially older ones) and do not indicate
all possible options as per above table.
(2) Please consult factory for detailed information.
(3) These options are EMC-relevant and are recommended
for industrial power applications, difficult noise
ambients, prototype experiments with flying leads
and for users without special EMC design experience.
(4) This option is not available in connection with
Sync. I/O for parallel connection. Please consult factory
for detailed information.
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Further technical information, detailed data sheets and mechanical
drawings are available on request. All data and specifications
subject to change without notice.
March 2006
|
