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LEM      |     DynAmp      |     Behlke      |     Empro
- Current Depending On-Time, SCR - Fixed On-Time, General Purpose, MOSFET
- Fixed On-Time, High di/dt, MOSFET - Fixed On-Time, High di/dt, Ultra Fast, MOSFET
- Fixed On-Time, Low Resistance, MOSFET - Variable On-Time, General Purpose, MOSFET
- Variable On-Time, High di/dt, MOSFET - Variable On-Time, Low Coupling Capacitance, MOSFET
- Variable On-Time, Low On-Resistance, MOSFET - Variable On-Time, AC Voltage, MOSFET
- Variable On-Time, General Purpose, IGBT - Variable On-Time, Thyristor / MCT
- Variable On-Time, Push-Pull, MOSFET  

FAST HIGH VOLTAGE SOLID-STATE SWITCHES


A

HV switches with current depending on-time, Thyristor / SCR



Robust and inexpensive HV switch for discharge applications and for the generation of damped sinusoidal oscillations in connection with fast high voltage FDA free-wheeling diodes
High peak current capability 
Extremely high di/dt without compromises in reliability and life expectancy due to a large number of single SCR’s with individual gate drive
Very overload tolerant  
 Easy firing by a simple TTL trigger pulse (2-5 V) 

Very compact and light weight 
● Many cooling options

 

Note: The model number contains coded information about voltage, current and turn-on behavior. The first digits stand for the voltage in kV, the last digit before the dash indicates the

turn-on behavior (0 = fixed on-time, 1 = variable on-time). The digits after the dash indicate the current  in Amperes x10. Special features are coded by the letters after a second dash.
Example HTS 60-100-SCR:  HTS = HV Thyristor Switch, 6 = 6 kV,  0 = current depending fixed on-time , 100 = 1000 Ampere, SCR = Silicone Controlled Rectifier (thyristor). The switch
models are sorted by the dimension of housing and by maximum operating voltage within the dimension category.


Model [sorted by
housing dimensions]

Description / Comment
● Preferred stock type ○ Lead time > 6 weeks  X Not for new development 

Dimensions
[mm3]

Voltage
[kV]

Pk. Current
[A]

Pk. Power
 [MW]

On-Time
[μs]

HTS 60-100-SCR Tubular housing with HV pigtails. Cooling options not available.
135 x 20 x 20
6.4
1000
6.4
35…∞
HTS 60-200-SCR LED indicators. Very compact design - CF options partly not applicable!
80 x 38 x 25
6.4
2000
12.8
35…∞
HTS 120-100-SCR LED indicators. Very compact design - CF options partly not applicable!
80 x 38 x 25
12.8
1000
12.8
35…∞
HTS 40-1000-SCR Sync. I/O for parallel connection.
89 x 64 x 31
4
10000
40
35…∞
HTS 80-200-SCR Sync. I/O for parallel connection.
89 x 64 x 31
8
2000
16
35…∞
HTS 80-500-SCR Sync. I/O for parallel connection.
89 x 64 x 31
8
5000
40
35…∞
HTS 160-200-SCR Sync. I/O for parallel connection. HV connection by pigtails only.
89 x 64 x 31
16
2000
32
35…∞
HTS 150-200-SCR LED indicators. Very compact design - CF options partly not applicable!
103 x 70 x 35
15
2000
30
35…∞
HTS 300-100-SCR LED indicators. Very compact design - CF options partly not applicable!
103 x 70 x 35
30
1000
30
35…∞
HTS 60-1000-SCR Sync. I/O for parallel connection.
122 x 64 x 31
6
10000
60
35…∞
HTS 120-200-SCR Sync. I/O for parallel connection.
122 x 64 x 31
12
2000
24
35…∞
HTS 120-500-SCR Sync. I/O for parallel connection.
122 x 64 x 31
12
5000
60
35…∞
HTS 240-200-SCR Sync. I/O for parallel connection. HV connection by pigtails only.
122 x 64 x 31
24
2000
48
35…∞
HTS 80-1000-SCR Sync. I/O for parallel connection.
153 x 64 x 31
8
10000
80
35…∞
HTS 160-500-SCR Sync. I/O for parallel connection.
153 x 64 x 31
16
5000
80
35…∞
HTS 160-200-SCR Sync. I/O for parallel connection.
153 x 64 x 31
16
2000
32
35…∞
HTS 320-200-SCR Sync. I/O for parallel connection. HV connection by pigtails only.
153 x 64 x 31
32
2000
64
35…∞
HTS 100-1600-SCR LED indicators & Sync. I/O for parallel connection
179 x 103 x 35
10
16000
160
35…∞
HTS 200-800-SCR LED indicators & Sync. I/O for parallel connection
179 x 103 x 35
20
8000
160
35…∞
HTS 220-800-SCR LED indicators & Sync. I/O for parallel connection
179 x 103 x 35
22
8000
176
35…∞
HTS 120-1600-SCR LED indicators & Sync. I/O for parallel connection
204 x 103 x 35
12
16000
192
35…∞
HTS 240-800-SCR LED indicators & Sync. I/O for parallel connection
204 x 103 x 35
24
8000
192
35…∞
HTS 160-1600-SCR LED indicators & Sync. I/O for parallel connection
253 x 103 x 35
16
16000
256
35…∞
HTS 320-800-SCR LED indicators & Sync. I/O for parallel connection
253 x 103 x 35
32
8000
256
35…∞
HTS 320-200-SCR LED indicators. Very compact design - CF options partly not applicable!
206 x 70 x 35
32
2000
64
35…∞
HTS 640-100-SCR LED indicators. Very compact design - CF options partly not applicable!
206 x 70 x 35
64
1000
64
35…∞
HTS 400-200-SCR LED indicators. Very compact design - CF options partly not applicable!
250 x 70 x 35
40
2000
80
35…∞
HTS 800-100-SCR LED indicators. Very compact design - CF options partly not applicable!
250 x 70 x 35
80
1000
80
35…∞
HTS 220-1000-SCR LED indicators & Sync. I/O for parallel connection
252 x 150 x 40
22
10000
220
35…∞
HTS 240-1000-SCR LED indicators & Sync. I/O for parallel connection
252 x 150 x 40
24
10000
240
35…∞
HTS 240-1200-SCR LED's, Sync. I/O,  housing style as before, but with separate control unit
170 x 150 x 30
24
12000
288
35…∞
HTS 440-1200-SCR Sync. I/O for parallel connection, separate control unit
312 x 200 x 45
44
12000
528
35…∞
HTS 600-200-SCR With LED indicators. HV connection by pigtails only.
372 x 120 x 50
60
2000
120
35…∞
HTS 1200-100-SCR With LED indicators. HV connection by pigtails only.
372 x 120 x 50
120
1000
120
35…∞
 HTS 350-800-SCR   LED indicators, with integrated free-wheeling diode, flange housing 372 x 200 x 45 35   8000 280 35…∞
HTS 500-1200-SCR Sync. I/O for parallel connection, separate control unit 372 x 200 x 50 50 12000 600 35…∞
HTS 1500-1000-SCR Sync. I/O for parallel connection, separate control unit on request 150 10000 1500 35…∞
Note: Any other customized voltage between 1 and 150 kV (AC/DC) and any other customized peak current between 1 and 100 kA is possible at moderate lead times (normaly 4-8 weeks). We do not charge extra costs for customized switches, if they can be realized on an existing platform. Please consult Behlke. We recommend direct liquid cooling (option DLC) or ceramic cooling fins (option CF-CER) or water cooling (option ILC) for the cooling at operating voltages above approx. 40 kV. Due to the strong electromagnetic fields, which can be caused by the high di / dt capabilty of the switches,  a separate control unit  (option SEP-C)  is recommended in all cases of unfavorable load circle wiring with large induction
loop areas. This applies especially for very large switching modules and if the di/dt is > 5 kA / μs.  For applications with small and medium switching modules we recommend printed circuit boards (eventually in multilayer technique) to minimize the stray inductance and to keep the areas of induction loops small.  A design with printed circuit boards ensures also
a reproducible EMC behavior of the whole electronic system.  Please ensure in any case,   that the load circle is in proper distance to the control circle to avoid magnetic feed-back effects, otherwise the internal safety electronics will detect a fault condition and the switch will be locked for 2 sec. after every shot. Most switches indicate this by a red LED.  
 

Options (1)

 

 

HFB

High Frequency Burst: Improved burst capability of driver by means of external buffer capacitors. Recommended if more than 10 pulses with less than 10 μs spacing are generated.

HFS

High Frequency Switching: External supply of auxiliary driver voltage (50-350 VDC according to type). Necessary if the specified “Maximum Operating Frequency” shall be exceeded.(2)

LP

Low Pass: Low pass filter at the control input. Propagation delay time will be increased by ~50 ns. Jitter + 500 ps.  Improved noise immunity and  less critical wiring in high speed applications. (3)

ST

Stage Tapping:  Connectors at the individual stages of stack in order to utilize single power semiconductors. To achieve fast rise times also at very low operating voltages (<0.01xVo).

ISO-25

25 kV Isolation:  Isolation Voltage increased to  25 kVDC. Housing dimensions may change for some models.

ISO-40

40 kV Isolation:  Isolation Voltage increased to  40 kVDC. Housing dimensions may change for some models.  Only in connection with option PT-HV.

ISO-80

80 kV Isolation:  Isolation Voltage increased to  80 kVDC. Housing dimensions may change for some models.  Only in connection with option PT-HV.

ISO-120

120 kV Isolation: Isolation Voltage increased to 120 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.

I-PC

Integrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors, snubbers, damping resistors, diodes, opto couplers).(2)

I-FWD

Integrated Free-Wheeling Diode:  Built-in parallel diode with short recovery time. In connection with inductive load only.

LS-C

LEMO socket for Control Connection. Input Z=100Ω. An assembled linkage cable (1m/3ft) with two plugs and one socket is included in supply. Improved noise immunity. (3)

PT-C

Pigtail for Control Connection: Flexible leads (l=75 mm) with AMP-Modu plug. Only for switches with pins, which must be replaced by pigtails in case of any cooling option except option ITC.

PIN-C

Pins for Control Connection: Gold plated pins for printed circuit board designs (special sockets available). This option is only relevant for switching modules which have pigtails as standard.

PT-HV

Pigtails for HV Connection: Flexible leads with cable lugs. For increased creepage. PT-HV is standard for all types with >25 kV switching voltage. Not recommended in extremely fast circuits.

ST-HV

Screw Terminals for HV Connection: Threaded inserts at the bottom of module (if not standard). For PCB design. Operation above 25 kV requires liquid insulation (Galden®/Oil) or potting.

UL94

Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2)

TH

Tubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case  of difficult assembly situations. (2)

FC

Flat Case: Height of standard plastic housings reduced to 19 / 25 mm. Not in combination with cooling options CF, GCF and DLC.

ITC

Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2)

CF

Non-Isolated Cooling Fins: Standard sizes in categories I to VII according to model. Nickel plated copper 0.5 mm, fin height 35 mm. For air and liquid cooling (e.g. Galden® or oil).

CF-1

Non-Isolated Cooling Fins d=1mm: Nickel plated copper 1.0 mm instead of 0.5 mm. The Max. Power Dissipation will be increased by ~80 %. For air and liquid cooling (e.g. Galden® or oil).

CF-X2

Non-Isolated Cooling Fins enlarged by x2: Fin area enlarged by factor 2. Not relevant in connection with liquid cooling.

CF-X3

Non-Isolated Cooling Fins enlarged by x3: Fin area enlarged by factor 3. Not relevant in connection with liquid cooling and forced air convection.

CF-CS

Non-Isolated Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2)

CF-LC

Non-isolated Cooling Fins optimized for liquid cooling: Double fins, nickel plated copper, height 20 mm. For the immersion in oil tanks etc. Forced convection recommended.

CF-GRA

Non-isolated Cooling Fins made of graphite. Very light weight compared to copper at similar heat transfer, but reduced heat capacity. 0.5 or 1 mm thickness, height 35 mm.

CF-CER

Isolated Cooling Fins made of ceramics. Heat transfer properties similar to alumina. Forced convection recommended, height 35 mm.

CCS

Ceramic Cooling Surface. Top side of switching module made of ceramics. Heat transfer properties similar to alumina. 20 kVDC isolation. Forced convection recommended.

C-DR

Cooling for Driver: Extra cooling for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2)

GCF

Grounded Cooling Flange: Nickel-plated copper flange for High Power applications. Max. isolation voltage 40kV. Increased coupling capacitance. In combination with option SPT-C only.

GCF-X2

Grounded Cooling Flange, Max. Continuous Power Dissipation increased by x2:  Thermal resistance “Switch to Flange” reduced for twice the power capability. (2)

ILC

Indirect Liquid Cooling:  Liquid cooling for all kind of conductive coolants incl. water. Internal heat exchanger made of ceramics. For medium power dissipation.

DLC

Direct Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling for high frequency applications. Non-conductive coolants only.

HI-REL

High Reliability / MIL Versions:  Available on request. (2)

 

 

(1) New option code:  Data sheets may differ from this coding system (especially older ones) and do not indicate all possible options as per above table.    (2) Please consult factory for detailed information.
(3) These options are EMC-relevant and are recommended for industrial power applications, difficult noise ambient, prototype experiments with flying leads and for users without special EMC design experience.

 

 


 

 

 

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