Options (1) |
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MBC |
Mechanical Backward Compatibility to the previous switch models. All connectors, dimensions and attachment identical to the "historical" switch models such as HTS 81,51,31 ff. |
HFB |
High Frequency Burst: Improved burst capability of driver by means of external buffer capacitors. Recommended if > 10 pulses with < 10 μs spacing are generated. |
HFS |
High Frequency Switching: Ext. supply of auxiliary driver voltage (50-350 VDC according to type). Necessary if the specified “Max. Operating Frequency” shall be exceeded. (2) |
LP |
Low Pass: Low pass filter at the control input. Propagation delay time will be increased by ~50 ns. Jitter + 500 ps. Improved noise immunity and less critical wiring. (3) |
UFTR |
Ultra Fast Thermotrigger: Advanced temperature protection for the high-voltage switch. Switch shut down within 5 seconds if Pd(max) is exceeded by 300% @ ΔT=25K (50to75°C) |
UFTS |
Ultra Fast Thermosensor:Temperature measurement directly on the power semiconductors by means of a special sensor with high electrical isolation and low thermal impedance. |
TT-C |
Customized Transition Time: Customized rise & fall times to meet individual design requirements. (2) |
MIN-ON |
Minimum On-Time: Individually increased Minimum On-Time to ensure a minimum on duration indepently of control signal. For safety relevant circuits. |
MIN-OFF |
Minimum Off-Time: Individually increased Minimum Off-Time to ensure a minimum off duration indepently of control signal. For safety relevant circuits. |
ST |
Stage Tapping: Connectors at the individual stages of stack in order to utilize single power semiconductors. To achieve fast rise times also at very low operating voltages. |
LNC |
Low Natural Capacitance: CN reduced by approx. 30%. To minimize cap. power losses in applications with high switching frequency and high switching voltage (Pc= V2 x C x f). |
LL |
Low Leakage Current: Off-state current reduced to less than 10% of the specified value. Not available in connection with the cooling fin options and for switches of the UF series. |
LN |
Low Noise: Internal power driver modified for zero noise emission for a specific period of time. Relevant in conjunction with sensitive detector amplifiers (e.g. SEV/MCP) only. (2) |
ISO-25 |
25 kV Isolation: Isolation Voltage increased to 25 kVDC. Housing dimensions may change for some models. |
ISO-40 |
40 kV Isolation: Isolation Voltage increased to 40 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV. |
ISO-80 |
80 kV Isolation: Isolation Voltage increased to 80 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV. |
ISO-120 |
120 kV Isolation: Isolation Voltage increased to 120 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV. |
I-PC |
Integrated Part Components: Integration of small part components according to customer’s specifications (e.g. capacitors, snubbers, damping resistors, diodes, opto couplers). (2) |
PC |
Pulser Configuration. Switch combined with custom specific part components. Integrated in a flange housing with hv connectors according to the customers specifications. (2) |
I-FWD |
Integrated Free-Wheeling Diode: Built-in parallel diode with short recovery time. In connection with inductive load only. |
I-FWDN |
Integrated Free-Wheeling Diode Network: Built-in parallel diode plus serial blocking diode with short recovery time. In connection with inductive load only. |
I-TS |
Integrated Thermo Sensor: Integrated temperature sensor for external temperature measurements according to customers specifications (NTC, KTY, PT-100 etc). |
LS-C |
LEMO socket for Control Connection. Input Z=100Ω. An assembled linkage cable (1m/3ft) with two plugs and one socket is included in supply. For improved noise immunity. (3) |
PT-C |
Pigtail for Control Connection: Flexible leads (l=75 mm) with AMP-modu plug. Refers to switching modules with pins only. Suggested for modules with options CF & GCF. |
PT-HV |
Pigtails for HV Connection: Flexible leads with cable lugs. For increased creepage. PT-HV is standard for all types with >25 kV switching voltage. Not for extremely fast circuits. |
ST-HV |
Screw Terminals for HV Connection: Threaded inserts at the bottom of module for PCB attachment. Operation above 25 kV requires liquid insulation (Galden®/Oil) or potting. |
SEP-C |
Separated Control Unit. Control unit with LED indicators in a separate housing (dim. 79x38x17 mm). Linkage cable (<1m) with plug. Control unit with soldering pins or pigtails. |
UL94 |
Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2) |
TH |
Tubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case of difficult assembly situations. (2) |
FC |
Flat Case: Height of standard plastic housings reduced to 19 mm or less. Not in combination with cooling options CF, GCF and DLC. |
ITC |
Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2) |
CF |
Non-Isolated Cooling Fins: Standard sizes in categories I to VII according to model. Nickel plated copper 0.5 mm, fin height 35 mm. For air and oil cooling. |
CF-1 |
Non-Isolated Cooling Fins d=1mm: Nickel plated copper 1.0 mm instead of 0.5 mm. The Max. Power Dissipation will be increased by ~80 %. For air and oil cooling. |
CF-X2 |
Non-Isolated Cooling Fins enlarged by x2: Fin area enlarged by factor 2. Not relevant in connection with liquid cooling. |
CF-CS |
Non-Isolated Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) |
CF-LC |
Non-isolated Cooling Fins optimized for liquid cooling: Double fins, nickel plated copper, 0.5 mm thickness, height 20 mm. |
CF-GRA |
Non-isolated Cooling Fins made of graphite. Very light weight compared to copper at similar heat transfer, but reduced heat capacity. 0.5 or 1 mm thickness, height 35 mm. |
CF-CER |
Isolated Cooling Fins made of ceramics. Heat transfer properties similar to alumina. Forced convection recommended, height 35 mm. |
CCS |
Ceramic Cooling Surface. Top side of switching module made of special ceramics. Heat transfer properties similar to alumina. Forced convection recommended. |
C-DR |
Cooling for Driver: Extra cooling for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2) |
GCF |
Grounded Cooling Flange: Nickel-plated copper flange for medium power. Max. isolation voltage 40kV. Increased coupling capacitance CC. |
ILC |
Indirect Liquid Cooling: Liquid cooling for all kind of conductive coolants incl. water. Internal heat exchanger made of ceramics. For medium power dissipation. |
DLC |
Direct Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling for high frequency applications. Non-conductive coolants only. |
HI-REL |
High Reliability / MIL Versions: Available on request. (2) |
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(1) New option code: Data sheets may differ from this coding system (especially older ones) and do not indicate all possible options as per above table.
(2) Please consult factory for detailed information.
(3) These options are recommended for industrial power applications, difficult noise ambients, prototype experiments with flying leads and for users without special EMC design experience. |
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