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LEM      |     DynAmp      |     Behlke      |     Empro
- Current Depending On-Time, SCR - Fixed On-Time, General Purpose, MOSFET
- Fixed On-Time, High di/dt, MOSFET - Fixed On-Time, High di/dt, Ultra Fast, MOSFET
- Fixed On-Time, Low Resistance, MOSFET - Variable On-Time, General Purpose, MOSFET
- Variable On-Time, High di/dt, MOSFET - Variable On-Time, Low Coupling Capacitance, MOSFET
- Variable On-Time, Low On-Resistance, MOSFET - Variable On-Time, AC Voltage, MOSFET
- Variable On-Time, General Purpose, IGBT - Variable On-Time, Thyristor / MCT
- Variable On-Time, Push-Pull, MOSFET  

FAST HIGH VOLTAGE SOLID-STATE SWITCHES


C7

HV switch with variable on-time, Thyristor / MCT



● Versatile HV switch with true relay character
● On-time controllable by TTL signal
● Low turn-on losses
● High surge current capability
● 200 Amps turn-off capability
● Excellent dv/dt immunity against HV transients

Note: The model number contains coded information about voltage, current and turn-on behavior. The first digits stand for the voltage in kV, the last digit before the dash indicates the turn-on behavior (0 = fixed on-time, 1 = variable on-time). The digits after the dash indicate the current in Amperes x10. Special features are coded by the letters after a second dash. Example HTS 41-300-MCT: HTS = HV Thyristor Switch, 4 = 4 kV, 1 = variable on-time, 300 = 3000 Ampere, MCT = MOS Controlled Thyristor


Model [sorted by
housing dimensions]

Description / Comment
● Preferred stock type ○ Limited stock X Not recommended for new development

Dimensions
[mm3]

Voltage
[kV]

Pk. Current
[A]

Peak Power
[MW]

On-Time
[μs]

HTS 41-300-MCT ○ X Limited quantity - not for OEM applications!
89 x 64 x 31
4
3000
12
1…∞
HTS 81-300-MCT ○ X Limited quantity - not for OEM applications!
116 x 64 x 31
8
3000
24
1…∞
HTS 101-300-MCT ○ X Limited quantity - not for OEM applications!
178 x 64 x 31
10
3000
30
1…∞
HTS 121-300-MCT ○ X Limited quantity - not for OEM applications!
178 x 64 x 31
12
3000
36
1…∞
HTS 151-300-MCT ○ X Limited quantity - not for OEM applications!
178 x 64 x 31
15
3000
45
1…∞
HTS 181-300-MCT ○ X Limited quantity - not for OEM applications!
178 x 64 x 31
18
3000
54
1…∞

Options (1)

HFB

High Frequency Burst: Improved burst capability of driver by means of external buffer capacitors. Recommended if more than 10 pulses with less than 10 μs spacing are generated.

HFS

High Frequency Switching: External supply of auxiliary driver voltage (50-350 VDC according to type). Necessary if the specified “Maximum Operating Frequency” shall be exceeded. (2)

LP

Low Pass: Low pass filter at the control input. Propagation delay time will be increased by ~50 ns. Jitter + 500 ps. Improved noise immunity and less critical wiring in high speed applications. (3)

MIN-ON

Minimum On-Time: Individually increased Minimum On-Time to ensure a minimum on duration indepently of control signal. For safety relevant circuits.

MIN-OFF

Minimum Off-Time: Individually increased Minimum Off-Time to ensure a minimum off duration indepently of control signal. For safety relevant circuits.

ST

Stage Tapping: Connectors at the individual stages of stack in order to utilize single power semiconductors. To achieve fast rise times also at very low operating voltages (<0.01xVo).

LN

Low Noise: Internal power driver modified for zero noise emission for a specific period of time. Relevant in conjunction with sensitive detector amplifiers (e.g. SEV/MCP applications) only. (2)

ISO-25

25 kV Isolation: Isolation Voltage increased to 25 kVDC. Housing dimensions may change for some models.

ISO-40

40 kV Isolation: Isolation Voltage increased to 40 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.

ISO-80

80 kV Isolation: Isolation Voltage increased to 80 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.

ISO-120

120 kV Isolation: Isolation Voltage increased to 120 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.

PL

Passive Lock: Special inhibit function for two single switches in fast push-pull circuits. The input of the passive switch will be locked by the activated switch to avoid turn-on by noise.

I-PC

Integrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors, snubbers, damping resistors, diodes, opto couplers). (2)

I-FWD

Integrated Free-Wheeling Diode: Built-in parallel diode with short recovery time. In connection with inductive load only.

I-FWDN

Integrated Free-Wheeling Diode Network: Built-in parallel diode plus serial blocking diode with short recovery time. In connection with inductive load only.

SPT-C

Shielded Pigtail for Control Connection: Cable (l=300mm, Z=100Ω) with LEMO plug+socket and 100Ω termination. Improved noise immunity in case of long distance to driver circuits. (3)

PT-C

Pigtail for Control Connection: Flexible leads (l=75 mm) with PCB connector. This option is only relevant for switching modules with pins. Recommended for modules with options CF & GCF.

PIN-C

Pins for Control Connection: Gold plated pins for printed circuit board designs (special sockets available). This option is only relevant for switching modules which have pigtails as standard.

PT-HV

Pigtails for HV Connection: Flexible leads with cable lugs. For increased creepage. PT-HV is standard for all types with >25 kV switching voltage. Not recommended in extremely fast circuits.

ST-HV

Screw Terminals for HV Connection: Threaded inserts at the bottom of module (if not standard). For PCB design. Operation above 25 kV requires liquid insulation (Galden®/Oil) or potting.

UL94

Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2)

TH

Tubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case of difficult assembly situations. (2)

FC

Flat Case: Height of standard plastic housings reduced to 19 mm or less. Not in combination with cooling options CF, GCF and DLC.

ITC

Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2)

CF

Non-Isolated Cooling Fins: Standard sizes in categories I to VII according to model. Nickel plated copper 0.5 mm, fin height 35 mm. For air and liquid cooling (e.g. Galden® or oil).

CF-1

Non-Isolated Cooling Fins d=1mm: Nickel plated copper 1.0 mm instead of 0.5 mm. The Max. Power Dissipation will be increased by ~80 %. For air and liquid cooling (e.g. Galden® or oil).

CF-X2

Non-Isolated Cooling Fins enlarged by x2: Fin area enlarged by factor 2. Not relevant in connection with liquid cooling.

CF-X3

Non-Isolated Cooling Fins enlarged by x3: Fin area enlarged by factor 3. Not relevant in connection with liquid cooling and forced air convection.

CF-CS

Non-Isolated Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2)

CF-LC

Non-isolated Cooling Fins optimized for liquid cooling: Double fins, nickel plated copper, 0.5 mm thickness, height 20 mm.

CF-DR

Cooling Fin for Driver: Small extra cooling fin for the control electronics. On ground potential. Can be necessary in combination with HFS. (2)

GCF

Grounded Cooling Flange: Nickel-plated copper flange for High Power applications. Max. isolation voltage 40kV. Increased coupling capacitance CC. In combination with option SPT-C only.

ILC

Indirect Liquid Cooling: Liquid cooling for all kind of conductive coolants including mains water. Internal heat exchanger made of ceramics. For medium power applications.

DLC

Direct Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling solution especally for high frequency applications. Non-conductive coolants only.

HI-REL

High Reliability / MIL Versions: Available on request. (2)

(1) New option code: Data sheets may differ from this coding system (especially older ones) and do not indicate all possible options as per above table. (2) Please consult factory for detailed information.
(3) These options are EMC-relevant and are recommended for industrial power applications, difficult noise ambients, prototype experiments with flying leads and for users without special EMC design experience.


 

 

 

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